ICChecker
Identification

How to identify the memory IC on a phone board

Everything downstream — the capacity, the price, whether a replacement will work — depends on reading one string of characters off one chip correctly. Here is how to find it and how not to misread it.

Step 1: find the right chip

A phone board carries dozens of ICs. Power management, RF, audio codec, charging, touch controller — all of them are integrated circuits, and none of them tell you anything about storage. You are looking for exactly one.

The memory IC is the large square or rectangular package sitting closest to the SoC, usually under a metal shield that has to come off first. Two shapes to expect:

  • A separate package next to the CPU. Typically 11×11mm to 15×15mm, clearly the second-biggest chip on the board. This is the common layout on budget and mid-range hardware.
  • Package-on-package, stacked on the CPU. On many designs the memory sits directly on top of the SoC. The marking you can see from above is the memory part number; the CPU underneath is not visible without separating them.

If you are unsure which of two candidate chips is the memory, read both markings. Only one will resolve in a memory catalogue — the other will be an SoC or PMIC part number and will return nothing.

Step 2: read the first line, and only the first line

This is where most failed lookups come from. A memory package usually carries three or four lines of laser etching, and only the top one is the part number.

KMQD60013M-B318  ← part number, this is the one
MRK47L3         ← lot code, changes every batch
KOR 1943        ← origin and date code

Lot codes and date codes look plausibly like part numbers — same character set, similar length — which is exactly why people type them in and get nothing back. If a lookup fails, check you took the top line before you check anything else.

Some Samsung packages also carry a small SEC logo block with a short three-digit code near it. That is a manufacturing marking, not a capacity code, and searching it will not return a part. The full part number is still the top line.

Step 3: light it properly

Laser etching has no ink and no colour. It is a texture change, and it is invisible under the wrong light. Two rules:

  • Light from a shallow angle. Hold the light source almost flat against the board so it rakes across the package surface. The characters throw tiny shadows and jump out. A ring light directly overhead does the opposite — it floods the surface and washes the marking to nothing.
  • Clean the package first. Flux residue, dust and fingerprints scatter light across the etching. Isopropyl on a lint-free swab, let it flash off, then look again.

Step 4: transcribe the ambiguous characters carefully

Memory part numbers mix letters and digits with no pattern that lets you infer one from context. Four pairs cause nearly every misread:

PairHow to tell them apart
0 / OZero is narrower and more oval; the letter O is rounder. On Samsung markings zero is usually slashed or squared.
1 / IThe digit 1 has a serif or flag at the top left; capital I is a plain bar.
5 / S5 has a flat horizontal top bar; S curves all the way round.
8 / B8 is symmetrical; B has a flat left edge.

You do not have to get this right first time. The IC checker matches on prefix, so typing the six or seven characters you are confident about narrows 16,776 parts down to a handful you can tell apart by package and capacity.

Step 5: check what the code means

Enter the code and you get the storage capacity, the package type, the physical package and — on stacked eMCP and uMCP parts — the LPDDR RAM in the same package. That is the answer you were after: what this board holds, independent of whether it powers on.

Different vendors encode capacity differently, so the string itself will not tell you at a glance. See IC code marking schemes by brand for what each prefix signals, and eMMC vs UFS vs eMCP for what the package type changes.

Common mistakes, in order of frequency

  • Reading the lot code. By a wide margin the most common. Take the top line.
  • Reading the wrong chip. PMIC and RF part numbers will never resolve in a memory catalogue.
  • Dropping a character. Worn packages lose the last one or two. Search the prefix instead of guessing.
  • Assuming the capacity from the phone model. The same model ships in several storage variants. The chip is the only reliable answer.
  • Trusting a seller's label on a scrap lot. Covered in the scrap buying guide.
FAQ

Questions

Which IC on the board is the memory?

The one nearest the CPU, and usually the second-largest chip on the board. On most phones the CPU and the memory package are stacked or sit side by side under the same shield. If two chips look similar, the memory is the one whose marking starts with a letter group like KLM, KM, H9 or MT.

What does IC mean on a phone board?

IC stands for integrated circuit — any chip on the board. In repair and scrap trade usage, "the IC" almost always means the memory IC specifically, because that is the one whose part number determines what the board is worth.

Do I need a microscope?

Not always. A 10× loupe reads most eMMC and eMCP markings. UFS packages on recent flagships are marked smaller and often need 20× or a phone camera in macro mode with the image zoomed afterwards. A microscope makes it faster, not possible.

The marking is completely gone. Now what?

If the laser etching has been polished off — common on reworked or previously reballed boards — the part number is unrecoverable visually. At that point the capacity can only be read electrically with a programmer, or inferred from the model if the board is identifiable. Treat an unmarked chip as unknown when pricing.